Dr. ShikangLi's work about “Programmable Unitary Operations for Orbital Angular Momentum Encoded States” was published on National Science Open
Our Lab. assisted in the organization of the seminar on interdisciplinary researches between electronics and architecture
The official WeChat of Tsinghua University reported the research achievements of our laboratory - "Use the chip as the "eye" and unlock the material code!"
Doctoral student Shan Zhang's work about the quantum source on silicon chip with switchable orbital angular momentum was published on Laser & Photonics Reviews
Prof. Yidong Huang participated in writing the textbook "Introduction of Electronic Information Science and Technology" and won the "Zhang Yujin Book Award of the Department of Electronics".
The first steering committee meeting of Tsinghua University-Zhuhai Huafa Industrial Share Company Joint Institute for Architecture Optoelectronic Technologies (JIAOT) was held successfully
Faculty members of our lab. attended and gave invited talks at the 13th International Conference on Information Optics and Photonics (CIOP2022)
Optoelectronic Industry Summit Forum – “The Future of Optoelectronic Chip” Closed with Success
H-Chip Tech completed factory construction of phase II optoelectronic chip industrialization project
Prof. Wei Zhang and Associate Prof. Xue Feng were invited to give a presentation at the "Forum on Photonic Integrated Circuits 2022 ".
"Key fabrication process and application of micro-nano structure optoelectronic chip" passed scientific and technological achievement appraisal
Congratulations to Prof. Kaiyu Cui on becoming a Bingkun Zhou Scholar of the Department of Electronic Engineering, Tsinghua University
Professor Yidong Huang and Ph. D students gave talks in the Conference on Laser and Electro-Optics 2022 (CLEO2022)
Congratulations！Peng Zhao and Xin Yao graduate from Tsinghua University and receive their Degrees of Doctor of Philosophy. Sirui Yuan and Weishao Huang graduate from Tsinghua University and receive their Master Degrees.2019-06-20