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Cooperated with Tangshan Dachang Conduction Technology Co., Ltd. on

Prof. Kaiyu Cui negotiated with Tangshan Dachang Conduction Technology Co., Ltd. and reached a cooperation intention on "Spectral imaging chip and method for temperature measurement in converter steelmaking" on July 25, 2020. Founded in December 2018, Tangshan Dachang Transmission Technology Co., Ltd. is a joint-stock enterprise of Tangshan Iron & Steel Group Co., LTD.

One of the key technologies for the end-point control of converter steelmaking is the accurate control of the end-point temperature of molten steel in molten pool, which currently depends on the on-site visual inspection of steelmaking workers and the thermocouple sampling after the end-point of steelmaking. Since it is difficult to guarantee the visual accuracy, and the temperature sampling in the later period cannot reflect the temperature change in the process of steelmaking in real time, the existing control technology of molten steel temperature in molten pool greatly affects the quality and production efficiency of converter steelmaking, which becomes a bottleneck problem that is difficult to solve in the field of steelmaking process. Spectral imaging chip can establish spectral data and algorithm model of converter steelmaking temperature by non-contact temperature measurement, and obtain real-time converter temperature, which is of great significance to end-point temperature measurement control and industrial automation in converter steelmaking.

崔开宇老师与唐山达创传导科技有限公司达成合作意向,签署“应用于转炉炼钢测温的光谱成像芯片及方法”的研发项目.jpg





2020年09月21日

News

The 6th annual gathering of our Nano-optoelectronics laboratory was successfully held2025-12-31

PhD Student Shurui Huang's research on Optimizing Electrodes for Ultra-high-speed Electro-optic Modulators was published on IEEE Photonics Journal2025-12-25

Prof. Fang Liu was elected as Vice Chairman of the Vacuum Electronics Branch of the Chinese Institute of Electronics2025-12-15

PhD. Student Yuxuan Liao’s research on large-scale optical tweezer array was published on Chinese Physics Letter.2025-12-11

Professor Hao Sun Delivered Invited Talk at SPIE-CLP Conference on Advanced Photonics 20252025-12-03

Professor Wei Zhang attended the 2025 Photonics and Electromagnetics Research Symposium (PIERS 2025 in Chiba) and provided an invited talk2025-11-28

The laboratory organized a meeting for mentors, 2025 undergraduate freshmen, and undergraduates of tailored program2025-11-18

Postdoctoral Researcher Li Tianchang Awarded "Top 10 Student Oral Presentation" at the 11th Terahertz Science and Technology Conference2025-11-02

Professor Wei Zhang organized the forum "Quantum Photonic Chips: Technology and Applications" at the 27th Youth Annual Conference of Chinese Institute of Electronics (CIE)2025-10-27

“On-chip Cherenkov radiation tuning in 3.2-14 THz” was published on Nature Communications2025-08-30

The work by Ph.D. candidates Mingzhong Hu and Jingyuan Zheng on photon-counting high-dimensional imaging was published in Laser & Photonics Reviews.2025-08-27

Ph.D. candidate Xiaosong Ren’s work about the integration of thin-film lithium niobate photonics chip and single-photon avalanche diode chip via photonic wire bonding was published on Laser & Photonics Reviews.2025-08-25

Prof. Cui Kaiyu leads team to attend the 10th Workshop on Microcavity Photonics and delivers invited talk2025-08-23

The work by Ph.D. candidate Dongning Liu on long-distance chip-to-chip quantum teleportation over optical fibers was published in Light: Science & Applications.2025-08-20

Prof. Yidong Huang and Wei Zhang were invited to attend the 16th International Conference on Information Optics and Photonics (CIOP2025)2025-08-15