CIOE 2021 (The 23rd China International Optoelectronic Exposition), as the world’s leading optoelectronic exhibition, was held at Shenzhen World Exhibition & Convention Center on September 16-18, 2021. The exhibition covered the entire optoelectronic ecosystem including information and communication, precision optics, sensing, lasers, infrared, and photonics.

Hi-Chip Technology Group was founded in November 2017, is the domestic high-end optoelectronic technology research and development of Portland, national high-tech enterprises, provincial gazelle. B round of financing has been completed. The main business is for high-end photoelectron chip technology research and development, the micro-nano structure and material characterization analysis, as well as the high and new technology enterprise investment. Currently has more than 70 people in the high level of technical team, support the processing technology such as silicon-based optoelectronic integrated device, photonic crystal microcavity, lithium niobate modulator, optical diffraction device, optical surface, nano-imprinting stamper, III - V laser/detector films, and has a number of nanoscale features of the process and advanced characterization of module. They have provided OEM services for more than 400 institutions of high-end optoelectronic process research and development. In the exhibition, they exhibited the international leading processing cases, such as silicon nano stamping template for AR lens processing, optical metasurface and DOE for light field regulation, poled lithium niobate waveguide for AWG or electro-optic modulation, microring, grating devices, etc.

Seetrum was founded in October 2020 and have completed angel, strategic, and PreA round of financing, with a post-investment valuation of 1.25 billion RMB. The engineering of some application scenarios has been completed, and a number of products such as real-time spectral water quality monitoring and spectral detection modules have been developed. This time, they exhibited the GS0226 Ultraspectral Sensing Chip and GI3307 Multispectral Imaging Chip. The chips are manufactured based on CMOS processing and are reconfigurable for three models of multispectral, hyperspectral, and ultraspectral. The wavelength detecting range can be expanded to ultraviolet, visible light, near-infrared, and mid-to-far infrared.

The new technologies of both companies attracted the visit and attention of many professional audiences.