Research achievements of our laboratory won the 2022 Tianjin " Special Grand Prize for Technology Invention "
On April 26, 2023, Tianjin Science and Technology Award Conference was held in Tianjin Auditorium. The achievement of "Key preparation process and application of micro-nano structure optoelectronic chips", which was completed with the participation of several faculty members in our laboratory, was awarded the " Special Grand Prize for Technical Invention" by Tianjin Government.
After returning to China in 2003, Prof. Yidong Huang set up the Nano-optoelectronics Laboratory to focus on the research frontier of optoelectronic chips. She led to make original breakthroughs in the core fabrication technology of nano-structures such as photonic crystals, surface plasmon polariton, and photomechanical microcavities, and formed the systematic fabrication process system of nano-optoelectronic chips. Key technological indicators have reached the international leading level.
On this basis, the High-end Optoelectronic Chip Innovation Center was set up in Tianjin Electronic Information Research Institute of Tsinghua University. Prof. Huang co-founded Tianjin H-chip Technology Group Co., LTD with Dr. Di Qu, a PhD graduate of our laboratory, to fully take charge of the industrial transformation of the laboratory's process technology. We provide customized chip fabrication and process development for more than 500 research teams' cutting-edge research and enterprises' new product research and development, which effectively promotes the innovative research and industrial development in the field of nano-optoelectronics in China, and cultivates a group of research and industrial talents.
Relying on the award-winning nano-structure fabrication technology, it successfully developed a batch of internationally leading optoelectronic chips, including the world's first real-time ultra-spectral imaging chip and free electron radiation chip. It will be of great significance to lead the frontier and technological innovation direction of optoelectronic chips, and in the next round of international competition of chip, it will help our country to get out of "coreless" dilemma.
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